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  • 5 February 2010 13:23

VIA Launches Pico-ITXe Platform for Fleet Management Devices

VIA EPIA-P710-D Pico-ITXe module creates the ultimate platform for next-generation fleet management designs

Taipei, Taiwan, 4 February 2010 - VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its latest technology platform for fleet management device designs. The VIA EPIA-P710-D is a Pico-ITXe expansion module that allows system integrators to easily create cutting-edge fleet management devices that incorporate a range of the latest communication and intelligent management technologies.

Designed for easy integration into the dashboard of any vehicle, this new fleet management hardware platform provides the advanced x86 backbone necessary for today’s advanced fleet and logistics management applications including fuel management, active scheduling, advanced routing, asset monitoring and the latest emergency, safety and rescue features.

“The VIA EPIA-P710-D can be used to create a range of incredibly versatile and full featured in-vehicle devices that can communicate and increasingly make intelligent management decisions,” said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. “The Pico-ITXe standard also offers a uniquely modular approach to platform design, facilitating faster time-to-market and design cycles.”

The VIA EPIA-P710-D Pico-ITXe Expansion Module The VIA EPIA P710-D works in tandem with the Pico-ITXe-based VIA EPIA-P710 board, adding an I/O feature set tailor-made for fleet management device design. These include three Mini PCI Express slots that can be used to employ a wide range of Wi-Fi, GSM, 3G/3.5G, GPS and GPRS modules depending on specific regional and application requirements.

The VIA EPIA-P710-D is designed to accurately suit any device that is fitted directly to the dashboard, occupying one DIN unit. The VIA EPIA-P710 board is connected using SUMIT™ connectors, positioning the VIA Eden processor downwards allowing simple passive cooling designs that can incorporate the chassis of the device.

Front side I/O includes a SIM slot and SD card reader for easy access to GSM services and local data storage, as well as access for two USB 2.0 ports, audio jacks and HDD activity and power LEDs. Internal storage needs are provided by both IDE and SATA ports with rear I/O providing access to VGA, COM, UART and GPIO technologies.

The VIA EPIA-P710: The World’s First Pico-ITXe Board Measuring only 10cm x 7.2cm, the VIA EPIA-P710 is the very first board to take advantage of the new Pico-ITXe standard and SUMIT connector specifications. Powered by a 1.0GHz VIA Eden processor and the VIA VX800 media system processor, the compact VIA EPIA-P710 is incredibly versatile with a full feature set that makes it perfect for a range of segment specific, I/O-centric embedded applications

For more information about the VIA EPIA-P710 and the VIA EPIA-P710-D expansion module, please visit:

Images related to this announcement can be found at the VIA Gallery:

Pico-ITXe – A modular approach Pico-ITXe is an open, multi-sourced standard based on the VIA-developed Pico-ITX form factor. Using the same 10cm x 7.2cm dimensions as Pico-ITX, the Pico-ITXe specification includes unique fixed mounting holes and specially designed SUMIT connectors to allow easy development of compact, stackable, I/O-centric embedded devices. Products like the VIA EPIA-P710 Pico-ITXe board act as the perfect base board, taking advantage of an intelligent board layout that greatly aids both heat dissipation and stackability within a remarkably small footprint.

To learn more about the Pico-ITXe form factor specification, please visit:

About VIA Technologies, Inc. VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators.

VIA PR Contact

International: Richard Brown Phone: (886)-2-2218-5452 #6201 Fax: (886)-2-8218-6752 Email:

Note to reporters, editors and writers: VIA is written in ALL CAPS.

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