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  • 1 May 2013 12:37

VIA Announces Latest VIA Pico-ITX Board to Jump Start In-Vehicle Innovation, VIA VAB-600

Ultra low power design with optional 3G connectivity and battery power support ideal for a broad range of in-vehicle and mobile applications

Taipei, Taiwan, 30th April, 2013 - VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA VAB-600 Pico-ITX embedded board. Featuring an 800MHz ARM Cortex-A9 processor, the VIA VAB-600 combines a wide operating temperature range (0°C up to 60°C) with extremely low power consumption and optional 3G connectivity to fuel in-vehicle innovation as well as a broad range of mobile and healthcare applications. The VIA VAB-600 Pico-ITX board features a rich I/O set with superb multimedia performance, including a built-in Multi-standard decoder for playback support of the most demanding video formats in resolutions up to 1080p. Leveraging VIA’s hardware design expertise, the VIA VAB-600 includes a broad range of on-board pin-headers to provide optional 3G or WiFi connectivity, touch screen support and support for either battery or 12V~24V DC-in power options in an ultra-compact design.

Customers can take advantage of VIA’s worldwide embedded software development expertise to quickly create customized designs for a fast time-to-market approach and is available as a hardware starter kit. Board support packages (BSPs) for either Android (4.0) or Embedded Linux (Kernel 3.0.8) operating systems are also available.

“The VIA VAB-600 Pico-ITX allows our customers to jump start innovation for in-vehicle and mobile applications,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “By leveraging our starter kits and customization expertise, customers are provided with a flexible development path to quickly and easily bring new products to market.” VIA VAB-600 Pico-ITX Based on the ultra compact Pico-ITX form factor, measuring 10 cm x 7.2 cm, the VIA VAB-600 combines an 800MHz ARM Cortex-A9 processor with a built-in 2D/3D graphics engine, supporting OpenGL® ES 2.0, to deliver a smooth user experience and superb multimedia performance. Customers can leverage our starter kits which include a VIA VAB-600 Pico-ITX board, VAB-600-A I/O card, VAB-600-C TTL Converter card, 7” touch screen TTL panel, cables and 18W AC adaptor. Rear I/O includes one Mini HDMI port, two Mini-USB 2.0 ports, one 10/100 Ethernet port and 1 12~24V DC-in jack. On-board features include 4GB eMMC Flash memory, 1GB DDR3 SDRAM, one DVO connector for TTL or LVDS display, two COM ports, SPI, one USB 2.0 connector, one Mini Card slot (supports USB 2.0 connectivity for optional WiFi module VNT9271B6050), support for one SIM card slot, touch screen connector, front pin headers for line-in/out and MIC-in, I2C and GPIO pin header, and one battery charger connector with smart battery function. For more information about the VIA VAB-600 Pico-ITX, please visit: For more information about our VIA VAB-600 evaluation kits, please visit: For images related to this release, please visit: Availability Sample units of the VIA VAB-600 Pico-ITX board are available at the time of this release. About VIA Technologies, Inc.

VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. VIA PR Contact International: Richard Brown Phone: (886)-2-2218-5452 #6201 Fax: (886)-2-8218-6752 Email: Note to reporters, editors and writers: VIA is written in ALL CAPS. The names of actual companies and products mentioned herein may be the trademarks of their respective owners.

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